ELECTRONIC-COMPONENT-INCORPORATING BOARD, ELECTRONIC APPARATUS USING THE SAME, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To simplify and improve the reliability of inter-layer connection in an electronic-component-incorporating board incorporating therein a semiconductor bare chip IC.

SOLUTION: The electronic-component-incorporating board includes a metal block 27 which is mounted on the upper surface of a second conductive pattern 6 to be lower than the post-mounted height of an electronic component 5 incorporated in a second insulating layer 4, and a via-hole 8 which penetrates the second insulating layer 4 to electrically connect the metal block 27 to a third conductive pattern 7 via a second solder film 9. Using the metal block 27 lower than the post-mounted height of the electronic component 5 enables determining the height of the second insulating layer 4 to be a height depending on the height of the electronic component 5 and reducing the depth of the via-hole 8. As a result, connection between the metal block 27 and the third conductive pattern 7 via the second solder film 9 can be carried out certainly.

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