ADHESIVE COMPOSITION, METHOD FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a semiconductor device using an adhesive composition that has enough heat resistance and moisture resistance required for mounting semiconductor elements having a large coefficient of thermal expansion on a substrate for mounting semiconductor, and that can suppress the amount of volatile portions at the time of use, and to provide an adhesive film.

SOLUTION: The adhesive composition comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with the epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator, and the adhesive film 2 comprises the adhesive composition formed into a film. The method for producing the semiconductor device comprises laminating the adhesive film 2 and a dicing tape to a wafer, cutting the wafer and the adhesive film 2 into a chip 1, and adhering the chip 1 to a substrate having a circuit or a film having a circuit 3 through the adhesive film 2.

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