| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide adhesive tape attachment equipment that puts a belt-like adhesive tape and a precut adhesive tape to adaptive use, applying these adhesive tapes onto a ring frame and backside of a semiconductor wafer. <P>SOLUTION: The adhesive tape attachment equipment has a work holding mechanism 5 for holding a ring frame and a wafer, a tape supply mechanism for supplying a continuous dicing tape DT or a continuous carrier tape onto attachment positions, the continuous carrier tape on which precut dicing tapes are pasted and held, an attachment unit 24 for attaching a continuous dicing tape DT or a precut dicing tape, separated from a carrier tape, onto a ring frame and a semiconductor wafer, a tape cutter 28 for cutting the dicing tape attached onto the ring frame according to the ring frame, and a residue tape recovery section 26 for rolling and recovering a residue tape DT' after it has been cut. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
