| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board, a mobile electronic apparatus, and a manufacturing method of the circuit board that facilitate inspection, with reduced cost and improved yield. <P>SOLUTION: Conductive land pads 11 and 12 that are used as inspection points are connected together by using a wiring pattern 13, to be formed on a circuit board 100. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
