| 摘要 |
The invention relates to a method for pumping through an orifice ( 30, 31 ) of a first substrate ( 1 ), a first volume of liquid ( 2 ) in contact with a first hydrophobic surface of said substrate, wherein a pressure variation between the first volume of liquid and a second volume of liquid ( 2 '), located in contact with said orifice and a second hydrophobic surface of said substrate, is achieved by electrowetting.
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