APPARATUS COMPRISING AN ELECTRONICS MODULE AND METHOD OF ASSEMBLING APPARATUS
摘要
<p>An apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded layer form a portion of a rigid housing.</p>
申请公布号
WO2008104823(A1)
申请公布日期
2008.09.04
申请号
WO2007IB00595
申请日期
2007.03.01
申请人
NOKIA CORPORATION;HASHIZUME, KENICHI;OHHASHI, HIDEKI;MAATTA, ESA-SAKARI
