发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition used in ArF excimer laser lithography, etc., and suitable for thermal flow and a resist pattern forming method. <P>SOLUTION: The positive resist composition comprises a resin component (A) of which the solubility in an alkali developer is increased by the action of an acid and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) has a hydroxynaphthalene (meth) acrylate constitutional unit (a0) and the positive resist composition further comprises a crosslinkable polyvinyl ether compound (G). <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008203737(A) 申请公布日期 2008.09.04
申请号 JP20070042259 申请日期 2007.02.22
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMIZU HIROAKI;OSHITA KYOKO
分类号 G03F7/039;C08F20/10;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/039
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