| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface-protecting adhesive tape for solid state image pickup devices, effective for protecting the surface of an image sensor from contamination with foreign materials and damage in the production process of a solid state image pickup device in a high-temperature atmosphere and resistant to the peeling of the adhesive tape from the image sensor, and to provide a method for mounting a solid state image pickup device by using the adhesive tape. <P>SOLUTION: The surface-protecting adhesive tape for solid state image pickup devices has an adhesive layer on one surface of a substrate and the adhesive layer contains an lipophilic laminar clay mineral. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
