发明名称 ORGANIC-DEVICE MANUFACTURING METHOD AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an organic-device manufacturing method that prevents the occurrence of a parasitic capacitance and a leak path due to spreading, scattering or erroneous dropping or the like of a solution. <P>SOLUTION: The organic-device manufacturing method is provided with a step for arranging a solution including a conductive organic material on a substrate 10, a step for forming a conductive organic film 15 by drying the solution, and a step for reducing conductivity of conductive organic films 15a, 15b and 18 by emitting light L to the conductive organic films 15a, 15b, and 18 respectively arranged in each undesired region. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008205262(A) 申请公布日期 2008.09.04
申请号 JP20070040606 申请日期 2007.02.21
申请人 SEIKO EPSON CORP 发明人 NAKAMURA KIYOSHI
分类号 H01L29/786;G02F1/136;G02F1/167;G09F9/00;G09F9/30;H01L27/32;H01L51/05;H01L51/40 主分类号 H01L29/786
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