发明名称 CHIP-TYPE SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To improve the dimensional accuracy of a cathode metal layer and an anode metal layer, and improve the board mounting performance. SOLUTION: First, a dielectric oxide film, a solid electrolytic layer, and a cathode extraction layer 6 are sequentially formed on the surface of an anode element to which an anode lead-out line 3 is mounted, thereby a capacitor element is formed. Next, the capacitor element is covered with a powder coating resin 7. Then, the powder coating resin 7 is partially removed to expose a part of the cathode extraction layer 6. Further, the anode lead-out line 3 is exposed. Then, two linear ridges 8 for dividing the mounting surface 9 into three regions i. e. a cathode vicinity region 9a connected to the part of the cathode leader layer 6 exposed outside the powder coating resin 7, an anode vicinity region 9b connected to the anode lead-out line 3, and an intermediate region 9c connected to neither the cathode extraction layer 6 nor the anode lead-out line 3 are formed. Then, an electrically conductive metal layer is formed using an electrically conductive paste. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205130(A) 申请公布日期 2008.09.04
申请号 JP20070038463 申请日期 2007.02.19
申请人 NICHICON CORP 发明人 IMAI SHIGEO
分类号 H01G9/012;H01G9/00;H01G9/08 主分类号 H01G9/012
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