| 摘要 |
PROBLEM TO BE SOLVED: To reduce the space between semiconductor elements disposed on a cooler, while suppressing the thermal interference between the semiconductor elements disposed on the cooler. SOLUTION: A groove 4 disposed between the semiconductor elements 1 is formed in the cooler 2 wherein the semiconductor elements 1 are disposed, and auxiliary fins 5 for dissipating the thermal interference between the semiconductor elements 1 are provided to the position of the groove 4. COPYRIGHT: (C)2008,JPO&INPIT
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