| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent dielectric breakdown and heat resistances and to provide an electrical and electronic component using the resin composition. SOLUTION: The epoxy resin composition comprises an epoxy resin, an epoxy curing agent and clay. Furthermore, the clay is an organization-treated clay obtained by carrying out an organization treatment with at least an onium salt represented by general formula (1) (wherein, R<SP>1</SP>to R<SP>4</SP>represent each independently hydrogen, an aliphatic hydrocarbon, alicyclic hydrocarbon or aromatic hydrocarbon group; and at least one thereof is an 8-16C alkyl group or an 8-16C alkenyl group). COPYRIGHT: (C)2008,JPO&INPIT
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