MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE SUBJECTED TO HEAT TREATMENT BY USE OF OPTICAL HEATING APPARATUS

摘要

An auxiliary heating process is performed to set the temperature of the outer peripheral portion of a semiconductor substrate higher than that of the central portion thereof by use of an auxiliary heating source which supplementally heats a region of an area smaller than the area of the main surface of the semiconductor substrate from the rear surface of the main surface thereof, pulse-like flash lamp light or laser light is applied in the auxiliary heated state and the heat treatment is performed by use of the applied energy. The flash lamp light is applied to the main surface of the semiconductor substrate in a pulse form of 0.1 ms to 100 ms.