| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire saw improved in machining precision by minimizing mixture of chips to slurry circulated for reuse. SOLUTION: The wire saw is provided with: a wire drive part to drive rotation of a wire; a slurry supply part to supply slurry including abrasive grain to the wire; and an ingot pushing part to push a silicon ingot to a prescribed position of the wire, so that the ingot is sliced. The slurry supply part comprises: a slurry circulation passage to supply slurry to the wire; a first receiving plate disposed in a range below the silicon ingot to selectively receive slurry flowing down including chips; and a second receiving plate disposed in a range below a drive range of the wire to receive slurry flowing down from the wire. The second receiving plate is connected to the slurry circulation passage to compose a part of the circulation passage. Slurry received by the first receiving plate is not returned to the slurry circulation passage, but it is removed from the circulation passage. COPYRIGHT: (C)2008,JPO&INPIT |
