| 发明名称 |
Encapsulated Optical Package |
| 摘要 |
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.
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| 申请公布号 |
US2008211048(A1) |
申请公布日期 |
2008.09.04 |
| 申请号 |
US20060569751 |
申请日期 |
2006.11.29 |
| 申请人 |
ROLSTON DAVID ROBERT CAMERON;MAJ TOMASZ |
发明人 |
ROLSTON DAVID ROBERT CAMERON;MAJ TOMASZ |
| 分类号 |
H01L31/00;G02B6/42;H01L21/00 |
主分类号 |
H01L31/00 |
| 代理机构 |
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