发明名称 Cooling System for Electronics Housing
摘要 A cooling system through which liquid flows for carrying away waste heat for electronics housings is particularly suited for the automotive industry. The cooling system is adapted to the dimensions of the housing. The novel device is the first to create an effective cooling system for electronics housings with and for a number of circuit board levels, yet with a space-saving compact design.
申请公布号 US2008212281(A1) 申请公布日期 2008.09.04
申请号 US20060997750 申请日期 2006.06.21
申请人 SIEMENS VDO AUTOMOTIVE AG 发明人 KERNER NIKOLAUS;WEINZIERL CHRISTIAN
分类号 H05K7/20 主分类号 H05K7/20
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