发明名称 Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems
摘要 An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
申请公布号 US2008210405(A1) 申请公布日期 2008.09.04
申请号 US20060326690 申请日期 2006.01.06
申请人 DATTA MADHAV;MCMASTER MARK;BREWER RICK;ZHOU PENG;TSAO PAUL;UPADHAYA GIRISH;MUNCH MARK 发明人 DATTA MADHAV;MCMASTER MARK;BREWER RICK;ZHOU PENG;TSAO PAUL;UPADHAYA GIRISH;MUNCH MARK
分类号 F28F27/02;B21D53/02 主分类号 F28F27/02
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