发明名称 |
Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems |
摘要 |
An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
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申请公布号 |
US2008210405(A1) |
申请公布日期 |
2008.09.04 |
申请号 |
US20060326690 |
申请日期 |
2006.01.06 |
申请人 |
DATTA MADHAV;MCMASTER MARK;BREWER RICK;ZHOU PENG;TSAO PAUL;UPADHAYA GIRISH;MUNCH MARK |
发明人 |
DATTA MADHAV;MCMASTER MARK;BREWER RICK;ZHOU PENG;TSAO PAUL;UPADHAYA GIRISH;MUNCH MARK |
分类号 |
F28F27/02;B21D53/02 |
主分类号 |
F28F27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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