发明名称 |
Package structure to improve the reliability for WLP |
摘要 |
The present invention provides a package structure to improve the reliability for WLP (Wafer Level Package). The package structure includes at least two areas. One area is harder than another. The hard area sustains more shears resulting from board drop test than the soft area in order to disperse the shear in the soft area to avoid the peeling of the buffer layers within the soft area.
|
申请公布号 |
US2008211080(A1) |
申请公布日期 |
2008.09.04 |
申请号 |
US20070712365 |
申请日期 |
2007.03.01 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;LIN DIANN-FANG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|