发明名称 POLYESTER COMPOSITION AND POLYESTER MOLDING COMPRISING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a polyester composition that efficiently gives a heat-resistant hollow molding having excellent transparency and a molding comprising the same. SOLUTION: The polyester composition comprises chips of a solid-phase polymerization polyester mainly composed of an aromatic dicarboxylic acid component and a glycol component and 0.1-5,000 ppm of fine powder of polyester having the same composition as that of the solid-phase polymerization polyester. The ratio (IVs)/(IV) of the intrinsic viscosity (IVs) of chip surface layer part of the solid-phase polymerization polyester to the intrinsic viscosity (IV) of the chip is 1.05-1.35 and the ratio (IVc)/(IVs) of the intrinsic viscosity (IVc) of the central part of the chip of the solid-phase polymerization polyester to the intrinsic viscosity (IVs) of the chip surface layer part is 0.70-0.95. The polyester composition is mixed with 0.1 ppb-1,000 ppm of at least one kind of a resin selected from the group consisting of a polyolefin resin, a polyamide resin and a polyacetal resin. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005206677(A) 申请公布日期 2005.08.04
申请号 JP20040013862 申请日期 2004.01.22
申请人 TOYOBO CO LTD 发明人 HARA ATSUSHI;MATSUI YOSHINAO;NISHIMORI NAOKI;NAGANO HIROTA;YASUMURA TOMOYUKI;KIMURA NOBUTAKE;ETO YOSHITAKA
分类号 C08L67/02;C08G63/88;(IPC1-7):C08L67/02 主分类号 C08L67/02
代理机构 代理人
主权项
地址