| 摘要 |
<p>A single surface mounted type light emitting diode (LED) and fabricating method thereof are provided. The LED mainly comprises a die (1), a heat sink (2), two electrodes (3), wires (4), and a supporting structure (5). An excess region out of the heat sink (2) and the two electrodes (3) on the metal material tape (7) is firstly cut away, in order to form a basic shape; plastic material is jetted to form the supporting structure (5) in range of the heat sink and the two electrodes; then other excess portion of the metal material tape is further cut away, so that the heat sink and the two electrodes become an individual unit; then a wafer is mounted and boned wire; and after it is packaged, the light emitting diode is carried down from the metal material tape. Thus, the light emitting diode is completed.</p> |
