| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate which prevents a crack on a conductor by reducing a stress to be applied to a rise portion of a protruding electrode portion, and also to provide a semiconductor device using the same. SOLUTION: The semiconductor package substrate has a first insulative resin layer 2 having a semiconductor element 10 to be attached thereto; and a circuit conductor layer 3 provided on the first insulative resin layer 2 and electrically connected to the semiconductor element 10. The circuit conductor layer has a protruding electrode portion 4 which consists of a surface conductive layer 4a and an insulative resin 4b filled in the inside, and is electrically connected to an external mounting member. The cross sectional shape of the protruding electrode portion 4 is a substantial trapezoid having a bottom of a surface 4c connected to the external mounting member, and the rise portion of the protruding electrode portion 4 has a gentle round. COPYRIGHT: (C)2008,JPO&INPIT |
