| 摘要 |
PROBLEM TO BE SOLVED: To provide a charged powder for circuit formation capable of filling conductive metal particles densely in a wiring pattern, and a multilayer wiring board using the same. SOLUTION: The charged powder 10 for circuit formation is composed in such a manner that a first conductive metal powder 11, a second conductive metal powder 12 of which average particle diameter is smaller than that of the first conductive metal powder 11, a charge control agent 13, and an adhesion enhancing agent 14 are uniformly dispersed in a hot-melt resin 15. Spherical copper particles which are the first conductive metal powder 11 having an average particle diameter of 0.8μm, spherical copper particles which are the second conductive metal powder 12 having average particle diameter of 0.4μm, azo-series metal dye which is the charge control agent 13, silica which is the adhesion enhancing agent 14, and a styrene-acryl copolymer which is the hot-melt resin 15 are mixed at the ratio of 30:50:1:1:18 by weight. The mixture is then kneaded with a kneader by a hot-melt kneading, coarsely ground with a cutter mill, and finely ground with a jet mill. The charged powder 10 for circuit formation having average particle diameter is 8.0μm is acquired by air stream classification. COPYRIGHT: (C)2008,JPO&INPIT |
