发明名称 ELECTRONIC FUSE HAVING HEAT SPREADING STRUCTURE
摘要 A semiconductor device includes a fuse transistor for fuse programming and a fuse block connected to the fuse transistor, wherein the fuse block comprises a fuse line and a heat spreading structure connected to the fuse line. The electrical fuse employs the heat spreading structure connected to the fuse line to prevent a rupture of the electrical fuse such that heat, which is generated in the fuse line during a blowing of the fuse line, is spread throughout the heat spreading structure. Thus, a sensing margin of the electrical fuse can be secured and a deterioration of devices adjacent to the electrical fuse by heat generated in the electrical fuse can be prevented.
申请公布号 US2008211059(A1) 申请公布日期 2008.09.04
申请号 US20080013290 申请日期 2008.01.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KWON DAE-JIN;KIM WOO-SIK;SHIGENOBU MAEDA;LEE SEUNG-HWAN;WI SUNG-REY;QUAN WANG-XIAO;CHOI HYUN-MIN
分类号 H01L23/525 主分类号 H01L23/525
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