发明名称 INSERT MOLDED LEADFRAME ASSEMBLY
摘要 <p>An insert molded leadframe assembly (IMLA) for an electrical connector is disclosed. The IMLA may include an array of electrically conductive contacts, a dielectric leadframe housing overmolded onto the array of contacts, and a mass disposed within the leadframe housing. The additional mass may shift the IMLA's center of gravity, thereby providing a counterbalance to a non-proportional ball-grid array connector.</p>
申请公布号 WO2008106001(A1) 申请公布日期 2008.09.04
申请号 WO2008US01673 申请日期 2008.02.08
申请人 FCI;FCI AMERICAS TECHNOLOGY, INC.;MINICH, STEVEN 发明人 MINICH, STEVEN
分类号 H01R33/76;H01R11/01 主分类号 H01R33/76
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