发明名称 System and method for treating substrates
摘要 A system for treating substrates, provided with at least one processing chamber (1) to treat at least one substrate (5) with a vacuum process, wherein said processing chamber (1) is provided with a substrate access (13) closable by a closing body (15), wherein the system is provided with a conveying device (8) which is at least arranged to move said closing body (15), wherein said conveying device (8) is arranged to convey a mask (4), intended to at least partly cover said substrate (5) during said vacuum process, at least between a position outside the processing chamber (1) and a position inside the processing chamber (1). It is advantageous when at least said substrate holder (2) is provided with positioning means (50) to position the substrate holder (2) and the mask (4) relative to each other. The invention further provides a use of such a system.
申请公布号 EP1964941(A2) 申请公布日期 2008.09.03
申请号 EP20080158671 申请日期 2004.08.26
申请人 OTB GROUP B.V. 发明人 LINDELAUF, PAUL AUGUST MARIE;EVERS, MARINUS FRANCISCUS JOHANNES
分类号 C23C14/04 主分类号 C23C14/04
代理机构 代理人
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