METHOD FOR SURFACE TREATMENT OF SUBSTRATE AND METHOD FOR WIRING PATTERN FORMATION USING THE SAME

摘要

A surface processing method of a substrate and a method for forming a wire distribution pattern using the same are provided to form a micro pattern of a high quality by improving an adhesive strength of a wiring. A surface processing method of a substrate includes the steps of: preparing a substrate; processing a surface of the substrate with an KOH water solution; processing a surface of the substrate with an AgNO3 water solution; forming an Ag thin film layer by performing a heat-processing for the substrate; and coating the surface of the substrate with a coating solution having a fluoroacrylate compound. The substrate is selected from a group of a polyimide substrate, a polyester substrate, and an epoxy substrate. In the KOH water solution step, the substrate is digested under the KOH water solution for 30 minutes to 120 minutes.