PLUGGING METHOD OF VIA HOLE

摘要

A method for plugging a via hole is provided to improve a charging characteristic of plugging ink to a via hole by forming concavo-convex parts through a plasma process. A substrate plating process is performed to form a plating layer on an inner wall surface of a via hole by plating a substrate(S100). A substrate plasma process is performed to form concavo-convex parts on the plating layer(S200). An ink charging process is performed to fill the via hole with plugging ink(S300). A surface polishing process is performed to polish a surface of the substrate. The process for forming the concavo-convex parts includes a selective plasma process for forming the concavo-convex parts on the plating layer of the via hole.