发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing device that can perform uniform plasma processing on the surface of a workpiece. <P>SOLUTION: The plasma processing device generates a plasma (P) in a chamber (10) and performs plasma processing by applying a plasma product (A) generated from the plasma onto the surface of the workpiece (W). In addition, the plasma processing device is provided with a shielding body (40) that partly shields a space wherein the plasma product dispersing toward the surface of the workpiece is formed. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP4143362(B2) 申请公布日期 2008.09.03
申请号 JP20020245204 申请日期 2002.08.26
申请人 发明人
分类号 H01L21/3065;H05H1/46;B01J19/08;C23C16/50;H01L21/31 主分类号 H01L21/3065
代理机构 代理人
主权项
地址