An LED(Light Emitting Diode) illumination module is provided to dissipate effectively the heat and to improve efficiency of an electric connection arrangement of an LED array by transmitting directly the heat generated from the LED array to a heat sink. An LED illumination module includes a heat sink(203) for dissipating the heat, a PCB(Printed Circuit Board)(201) stacked on the heat sink, and one or more LEDs(100). Each LED includes an electrode portion and a heat dissipating portion(102). The electrode portion of the LED is connected to the PCB and the heat dissipating portion of the LED is directly connected to the heat sink. The LED further includes an LED chip for emitting light on the heat dissipating portion.
申请公布号
KR20070089393(A)
申请公布日期
2007.08.31
申请号
KR20060019364
申请日期
2006.02.28
申请人
KOREA PHOTONICS TECHNOLOGY INSTITUTE
发明人
SONG, SANG BIN;YOO, YONG SOO;YU, YOUNG MOON;YOM, HONG SEO