SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to shorten a heating path and to enhance heat-radiating efficiency by attaching directly a semiconductor chip to a heat-radiating plate. A first semiconductor chip(26) including a first connective terminal(27) is attached to one surface of a heat-radiating plate(20) including a through electrode(12). One surface of the through electrode is electrically connected to the first connective terminal. The first semiconductor chip is encapsulated by coating an insulator(30) on one surface of the heat-radiating plate. A second connective terminal(29) is formed on one surface of a second semiconductor chip(28). The other surface of the second semiconductor chip is attached to the other surface of the heat-radiating plate. The second semiconductor chip is encapsulated by coating the insulator on the other surface of the heat-radiating plate. A first via(36) is formed by punching the insulator coated on the other surface of the heat-radiating plate.