| 摘要 |
Disclosed is a microelectronic machine (X) comprising a microelectronic machine part (10), an insulating substrate (21), a through conductor (22c) provided to the insulating substrate (21), a sealing material (30) and a conductive connection material (40). The microelectronic machine part (10) comprises a semiconductor substrate (11), a microelectronic machine mechanism (12), and an electrode (13) which is electrically connected with the microelectronic machine mechanism (12). The sealing material (30) is composed of a glass and so arranged between the semiconductor substrate (11) and the insulating substrate (21) as to surround the microelectronic machine mechanism (12), thereby hermetically sealing the microelectronic machine mechanism (12). The conductive connection material (40) electrically connects the electrode (13) and an end of the through conductor (22c) at a position apart from the sealing material (30). |
