| 发明名称 |
Semiconductor package and a method for producing the same |
| 摘要 |
A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 mum or more and 100 mum or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits are provided.
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| 申请公布号 |
US7327041(B2) |
申请公布日期 |
2008.02.05 |
| 申请号 |
US20020154834 |
申请日期 |
2002.05.28 |
| 申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
DOTTA YOSHIHISA;TAMAKI KAZUO |
| 分类号 |
H01L23/48;H01R11/01;H01L21/56;H01L21/60;H01L21/68;H01L23/12;H01L23/14;H01L23/552 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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