摘要 |
An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semiconductor component, and includes a window allowing light to pass through it toward the optical sensor. An optical lens ( 17 ) is disposed in the cavity ( 6 ) between the optical sensor ( 10 ) and the window ( 5 ). A support structure ( 18 ) supports the optical lens. This optical semiconductor module may also include a shield ( 24 ).
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