Semiconductor device and method of manufacturing the same

摘要

A semiconductor device includes a laminated substrate (104; 204) formed by laminating a plurality of semiconductor substrates (101, 103; 201, 203), a concave part (103B; 208) formed in the laminated substrate, and a semiconductor element (109; 211, 213) mounted in the concave part. A method of manufacturing a semiconductor device includes a first step of forming a laminated substrate by laminating a plurality of semiconductor substrates, a second step of forming a concave part by etching the laminated substrate, and a third step of mounting a semiconductor element in the concave part.