发明名称 Circuit device and manufacturing method thereof
摘要 Provided is a circuit device having conductive patterns which are equally spaced apart and a manufacturing method thereof. A method for manufacturing a circuit device of the present invention includes the steps of: preparing a conductive foil; forming conductive patterns, which are included in a unit having at least regions for mounting circuit elements, by forming isolation trenches having a uniform width in the conductive foil; electrically connecting the conductive patterns to the circuit elements; sealing with a sealing resin so as to cover the circuit elements and to be filled in the isolation trenches; and removing the conductive foil in its thickness portions where no isolation trenches are provided.
申请公布号 US7420266(B2) 申请公布日期 2008.09.02
申请号 US20040953299 申请日期 2004.09.29
申请人 SANYO ELECTRIC CO., LTD. 发明人 TAKAHASHI KOUJI
分类号 H01L23/12;H01L23/495;H01L21/48;H01L23/28;H01L23/31;H01L23/50;H01L25/04;H01L25/18;H01L29/40;H05K1/02;H05K1/18;H05K3/20 主分类号 H01L23/12
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