| 摘要 |
A dummy work (DW: a work for printing a reference necessary for subsequent printing) is moved to a printing position while the dummy work is fixed to a work alignment mechanism 2 , and solder printing is made. The printed dummy work is then returned to the work alignment position and its image is taken by image processing cameras 7 and an image of position coordinates of a solder bump specified for alignment is stored. Positioning of subsequent works W is conducted on the basis of the image of the dummy work stored and solder printing of the works is subsequently made at the printing position.
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