发明名称 LASER PROCESSING APPARATUS AND METHOD
摘要 <p>A laser machining apparatus and a laser machining method are provided to improve machining quality of the workpiece and machining efficiency of the workpiece by machining a workpiece after splitting a laser beam projected in into at least two laser beams and moving a stage in the direction opposite to the irradiation direction of the laser beams. A laser machining apparatus comprises: a control part(101) for controlling the overall operation of the apparatus; a laser generating unit(103) for outputting a laser beam with a designated caliber; a beam splitting unit(105) for splitting a laser beam projected from the laser generating unit into at least two laser beams; a driver(107) for driving the beam scanner; an input part(109) for inputting control parameters and control instructions; an output part(111) for displaying information of an operating state, etc.; a storage part(113) for storing data; a beam scanner(115) enabling laser beams projected from the beam splitting unit to be scanned straightly and repeatedly in a designated section of a machining position on a workpiece; an optical system(117) for condensing laser beams reflected from the beam scanner to irradiate the condensed laser beam onto the workpiece; and a stage transfer unit(123) for transferring at least once a stage(121) having the workpiece placed thereon in the direction opposite to the irradiation direction of the laser beam while machining the workpiece.</p>
申请公布号 KR20080079828(A) 申请公布日期 2008.09.02
申请号 KR20070020329 申请日期 2007.02.28
申请人 EO TECHNICS CO., LTD. 发明人 HONG, EUN JEONG;JUNG, WON CHUL;KIM, TAE HYUN;LEE, HAK YONG;LEE, DONG JUN;RYOO, TAE KYOUNG;LIM, JAE KWAN
分类号 B23K26/067;B23K26/00 主分类号 B23K26/067
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