| 摘要 |
A positive type photosensitive resin composition is provided to realize excellent solvent resistance, water resistance, alkali resistance, heat resistance, transparency and adhesion to an underlying substrate. A positive type photosensitive resin composition comprises: (A) a copolymer obtained by polymerizing (a1) a radical polymerizable monomer represented by the following formula (I) and (a2) another radical polymerizable monomer different from the radical polymerizable monomer represented by formula (I); and (B) 1,2-quinonediazide compound. In formula (I), R1 is H, C1-C5 alkyl or C1-C5 fluoroalkyl; and each of R2, R3 and R4 represents OH, C1-C5 alkyl, C1-C5 alkoxy or a group represented by the formula of -O(Si(ClH2l+1)2O)mSi(CpH2p+1)3 (wherein l is an integer of 1-5, m is an integer of 0-10, n is an integer of 1-5; and p is an integer of 1-5).
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