| 摘要 |
[PROBLEMS] To provide a mounting board capable of evaluating wiring pattern characteristics, by which characteristics to a high frequency signal or a high speed pulse signal of a wiring pattern on the mounting board can be previously evaluated at a step prior to manufacturing substrates in mass-production. [MEANS FOR SOLVING PROBLEMS] A board main body (1) is provided with a test pattern (2) having various wiring patterns as element patterns, and a testing IC chip (3) which detects a detection signal by transmitting a high frequency and/or high speed pulse signal to the test pattern (2). Since the testing IC chip (3) outputs a detection signal and/or test results based on the detection to the external, a specific manufacturing accuracy of the wiring pattern to the high frequency or the high speed pulse signal can be detected as digital data. Thus, the characteristic evaluation of the wiring pattern can be highly accurately and easily performed by the board itself, under the same conditions as those in the mounting status of the mass-produced board. |
