发明名称 |
Apparatus and method for miniature semiconductor packages |
摘要 |
A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.
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申请公布号 |
US7419855(B1) |
申请公布日期 |
2008.09.02 |
申请号 |
US20060607141 |
申请日期 |
2006.12.01 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
LEE SHAW WEI;TU NGHIA THUC;NADARAJAH SANTHIRAN S/O;SOON LIM PENG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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