| 摘要 |
<p>A chip bonding tool, and an apparatus and a method of a flip chip bonding having the same are provided to prevent the contamination of a pressurizing block by employing a protrusion section formed on the pressurizing block for maintaining a gap between a semiconductor chip and the pressurizing block. A pressurizing block(121) pressurizes a semiconductor chip(6) and transmits a laser beam. A protrusion section(123) transmits the laser beam and absorbs the semiconductor chip. The protrusion section is prepared on a lower of the pressurizing to separate the pressurizing block from the semiconductor chip. A width of the pressurizing block is greater than that of the semiconductor chip, and a width of the protrusion section is less than that of the semiconductor chip. A lower surface of the protrusion section being contacted with the semiconductor chip is located in an upper surface of the semiconductor chip.</p> |
