发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME |
摘要 |
<p>A semiconductor integrated circuit device and a manufacturing method thereof are provided to supply a well bias voltage and a substrate bias voltage by using a dummy gate pattern instead of a wiring. A dummy pattern is extended in one direction on a semiconductor substrate(100). A junction region(220,320) is formed to connect electrically the semiconductor substrate with the dummy pattern. A voltage applying unit applies a bias voltage to the dummy pattern. A first conductive type well is formed in the semiconductor substrate. The junction region is electrically connected to the dummy pattern within the first conductive type well. The dummy pattern includes polysilicon. The dummy pattern further includes a metal layer.</p> |
申请公布号 |
KR100855558(B1) |
申请公布日期 |
2008.09.01 |
申请号 |
KR20070066181 |
申请日期 |
2007.07.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, BONG HYUN;CHOI, JUNG YUN |
分类号 |
H01L21/336;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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