| 摘要 |
An image sensor module, a camera module having the same, and a method of manufacturing the image sensor module are provided to reduce an overall height of the camera module by joining IR(InfraRed) filters with each other using an insulation tape. An image sensor module includes an image sensing element(111), a via-hole(113), a conductive member(114), and a bump ball(115). The image sensing element includes an imaging region and a bonding pad. The imaging region converts an input beam energy into an electrical signal. The bonding pad serves as a gate toward an external circuit. The via-hole penetrates the image sensing element from an upper surface to a lower surface. The conductive member is filled in the via-hole. The bump ball is formed on one side of the via-hole, where the conductive member is filled, to generate an electrical coupling between the image sensing element and the external circuit.
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