An electronic device package is provided to extend the entire surface of a case to efficiently release heat radiated from the case by forming a plurality of protrusions in a lower surface of the case to be spaced apart from each other. An electronic device package(50) includes a substrate and a case(100). The case is engaged with the substrate to protect an electronic device mounted on the substrate. The case has a plurality of protrusions(150) spaced apart from each other. A shape of each of the protrusions is a rectangular parallelepiped or cylinder. A height of each projection is lambda/2 of a signal generated by the electronic device. The case is made by cast iron or nickel silver. Eight to twelve protrusions are formed per length corresponding to a wavelength of the signal generated by the electronic device. The plurality of protrusions have different heights. A hole is formed in an upper surface of each protrusions.
