发明名称 |
MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS |
摘要 |
<p>MOVABLE ELECTRONIC FLAME-OFF DEVICE FORA BONDING APPARATUS A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic device for indexing. A flame-off torch is locatable adjacent to the bonding tool and is operative to produce sparks to melt a tip of the wire for bonding. An actuator is further provided that is operative to lower the flame-off torch close to the electronic device during bonding and to raise the flame-off torch away from the electronic device during indexing so as to provide a height clearance between the flame-off torch and the clamping device at its second position. (FIG. 5)</p> |
申请公布号 |
SG141348(A1) |
申请公布日期 |
2008.04.28 |
申请号 |
SG20070066707 |
申请日期 |
2007.09.11 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
KWAN KA SHING, KENNY;HAO CHEN CHONG;GANG OU;SONG KENG YEW, JAMES |
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