发明名称 MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS
摘要 <p>MOVABLE ELECTRONIC FLAME-OFF DEVICE FORA BONDING APPARATUS A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic device for indexing. A flame-off torch is locatable adjacent to the bonding tool and is operative to produce sparks to melt a tip of the wire for bonding. An actuator is further provided that is operative to lower the flame-off torch close to the electronic device during bonding and to raise the flame-off torch away from the electronic device during indexing so as to provide a height clearance between the flame-off torch and the clamping device at its second position. (FIG. 5)</p>
申请公布号 SG141348(A1) 申请公布日期 2008.04.28
申请号 SG20070066707 申请日期 2007.09.11
申请人 ASM TECHNOLOGY SINGAPORE PTE LTD 发明人 KWAN KA SHING, KENNY;HAO CHEN CHONG;GANG OU;SONG KENG YEW, JAMES
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