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发明名称
防止引脚弯折处断裂之半导体封装载膜与封装构造
摘要
一种防止引脚弯折处断裂之半导体封装载膜主要包含一可挠性介电层、复数个形成于该可挠性介电层上之引脚以及一局部覆盖该些引脚之防焊层。每一引脚系具有一内接线与一外引脚,该内接线与该外引脚之最小夹角系介于90度至180度。其中至少一引脚系具有一缓冲垫,其系连接该内接线与该外引脚且被该防焊层所覆盖。藉此可防止该些引脚受应力拉扯而在弯折处造成断裂之问题。另揭示使用该载膜之半导体封装构造。
申请公布号
TW200830507
申请公布日期
2008.07.16
申请号
TW096100368
申请日期
2007.01.04
申请人
南茂科技股份有限公司
发明人
李明勋;洪宗利;刘孟学
分类号
H01L23/488(2006.01)
主分类号
H01L23/488(2006.01)
代理机构
代理人
许庆祥
主权项
地址
新竹市新竹科学工业园区研发一路1号
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