发明名称 |
Resin component for encapsulating semiconductor and semiconductor device using it |
摘要 |
A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element. <IMAGE> |
申请公布号 |
EP1265280(B9) |
申请公布日期 |
2008.08.27 |
申请号 |
EP20020011955 |
申请日期 |
2002.05.29 |
申请人 |
SONY CORPORATION;NITTO DENKO CORPORATION |
发明人 |
TOYODA, JUNICHI;OKAYAMA, KATSUMI;IGARASHI, KAZUMASA |
分类号 |
C08L63/00;H01L23/29;C08G59/62;C08K7/18;H01L23/31;H01L23/552;H05K9/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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