发明名称 Emitting surface of light emitting diode packages
摘要 A LED package comprises: - a LED chip (1) mounted on a housing, and - an essentially transparent layer (2) on top of the LED chip (1), the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distributed over the plane of the light exit surface (4). The microstructures (5) are geometrically designed for enhancing the light exit by the microstructures (5) offering differing angles for light rays from the interior of the transparent layer (2).
申请公布号 EP1962350(A1) 申请公布日期 2008.08.27
申请号 EP20070102900 申请日期 2007.02.22
申请人 LEXEDIS LIGHTING GMBH 发明人 TASCH, STEFAN;DERKITS, CHRISTIAN;CHELLY, NADER
分类号 H01L33/48;H01L33/54 主分类号 H01L33/48
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