| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device without generating vibration, providing a reduced size of an electronic equipment, and having a higher cooling capability than that of the method for using an air free convection. SOLUTION: The cooling device related to this invention comprises: a flow channel 2 in which a fluid flows; a first magnet 10 arranged at the side of the flow channel 2; a second magnet 20 opposed to the first magnet 10 by sandwiching the flow channel 2 with its polarity oriented so as to pull the first magnet 10 each other; and an object 1 to be cooled with at least a part of its surface exposed to the flow channel 2 and cooled by the fluid. Assuming that the extending direction of the flow channel 2 is a coordinate axis, the gradient of the square value of a magnetic flux density formed by the first magnet 10 and the second magnet 20 has peaks on the respective inlet side and outlet side of the flow channel 2. The object 1 to be cooled is located closer to the other peak position than that of the one square value of the gradient. COPYRIGHT: (C)2008,JPO&INPIT
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