| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition used for a printed circuit board combining a high bending property with a flexibility, an insulating material with a support base material, and a metal-clad laminated plate. SOLUTION: The resin composition for the printed circuit board contains: epoxy resin; maleimide; polyester urethane resin; and novolak version phenol resin, characterized in that an average molecular weight of the polyester urethane resin is 15,000 or less, a storage elastic modulus thereof is 100 MPa or more and 1 GPa or less, and moreover a content of the epoxy resin is 10 wt.% or more and 50 wt.% or less of the whole resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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